Solid state power source with frames for attachment to an electronic circuit

ABSTRACT

A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The embodiments of the invention relate to a solid state power source,and more particularly, for example, to a solid state power source withframes for attachment to an electronic circuit. Although embodiments ofthe invention are suitable for a wide scope of applications, it isparticularly suitable for powering an electronic circuit in an implantdevice in which both the solid state power source and the electroniccircuit are hermetically sealed in an enclosure.

2. Discussion of the Related Art

In general, a conventional type of solid state power source includes ametallic battery encasement surrounding the bare structure of anelectrochemical cell. The metallic battery encasement can include topand bottom metal shells, which are insulated from one another. The sidesof the electrochemical cell are each respectively contacted by one ofthe top and bottom metal shells. An electrochemical cell can be acomponent having a positive cathode on one side, a negative anode on theother side, and an electrolyte between the cathode and anode. Solidstate power sources with such a structure are often referred to aseither coin or button cells.

The conventional attachment architectures for conventional types ofsolid state power devices typically have some sort of compressioncontact mechanism and a battery holder mounted on the electroniccircuitry for retaining and contacting the coin or button cell toelectronic circuitry. However, such a battery holder with the button orcoin cell fixated into a metal spring clip in turn consumes premiumvolume/space. That is, the volume of a conventional implementation of acomponent containing an electrochemical cell, including the batteryholder, the external compression contact mechanism, and the metallicbattery encasement, can be twice or three times as much as the volume ofthe bare structure of an electrochemical cell.

Solid state power sources that are hermetically sealed into a housing ofan electronic device, for example, facilitate the advancements inminiaturization of the implantable medical devices. It is desirable toreduce the device size so that the overall circuitry can be morecompact. Moreover, the miniaturization of implantable medical devices isdriving size and cost reduction of all implantable medical devicescomponents including the electronic circuitry.

Conventional techniques that lead to successful miniaturization ofimplantable enclosures included: a) minimizing the electronic circuitryof the sensor(s), monitors(s) and/or actuator(s); b.) minimizing thepower source(s); and/or c) minimizing the attachment architecture of thepower source(s) to the electronic circuitry. A power source havingconventional attachment architectures along with the metallic batteryencasement can take up the largest part of implantable enclosures. Ofcourse, the volume of the power source is most useful in a componentcontaining an electrochemical cell. However, the use of premiumvolume/space on spring clips as well as other auxiliary batteryholder/encasement materials can be unacceptable, up to the point wherean implantable enclosure with a specific type of electronic circuitrymay not make sense with regard to particular applications (e.g.medical), such as those with severe space or size limitations.

SUMMARY OF THE INVENTION

Accordingly, embodiments of the invention are, for example, directed toa solid state power source with frames for attachment to an electroniccircuit that substantially obviates one or more of the problems due tolimitations and disadvantages of the related art.

An object of embodiments of the invention is to provide a directmechanical and electrical attachment architecture for an electrochemicalcell to the electronic circuitry of an implantable device, which arethen both sealed into an air and fluid tight enclosure.

Another object of embodiments of the invention is to position a bareelectrochemical cell next to unprotected electronic circuitry within anair tight and fluid tight enclosure.

Another object of embodiments of the invention is to provide a solidstate electrochemical cell that includes an electrolyte that providesencapsulation and bonding of an electrochemical cell on frames to enableattachment of the frames to electronic circuitry under ambient airconditions.

Another object of embodiments of the invention is to provide anelectrochemical cell on frames with an attachment architecture havingboth terminals mechanically and electrically connected to an electroniccircuit located on one side of the electrochemical cell.

Another object of embodiments of the invention is to provide more thanone solid state electrochemical cell in the same attachment architectureconnected in parallel to electronic circuitry.

Additional features and advantages of embodiments of the invention willbe set forth in the description which follows, and in part will beapparent from the description, or may be learned by practice ofembodiments of the invention. The objectives and other advantages of theembodiments of the invention will be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof embodiments of the invention, as embodied and broadly described, thesolid state power source includes a first frame having a first contactportion, a first bonding portion and a first extension portion betweenthe first contact portion and the first bonding portion; a second framehaving a second contact portion, a second bonding portion and a secondextension portion between the second contact portion and the secondbonding portion; and a first pole layer, an electrolyte layer and asecond pole layer positioned between the first and second contactportions, wherein a first portion of the electrolyte layer is positionedbetween the first extension and the first pole and a second portion ofthe electrolyte layer is positioned between the first extension and thesecond pole.

In another aspect, a power source for a solid state device includes afirst frame having a first contact portion, a first bonding portion anda first extension portion between the first contact portion and thefirst bonding portion; a second frame having a second contact portion, asecond bonding portion and a second extension portion between the secondcontact portion and the second bonding portion; first and second sideencapsulant regions positioned between the first and second contactportions, and a first pole layer, a first electrolyte layer and a secondpole layer positioned between the first and second contact portions, andbetween the first and second side encapsulant regions.

In another aspect, a power source for a solid state device includes afirst frame having a first contact portion, a first bonding portion anda first extension portion between the first contact portion and thefirst bonding portion; a second frame having a second contact portion, asecond bonding portion and a second extension portion between the secondcontact portion and the second bonding portion; a first pole layer, anelectrolyte layer and a second pole layer positioned between the firstand second contact portions; and an encapsulant between the first andsecond contact portions, wherein the first and second bonding portionsare aligned in a first direction and the first and second contactportions are aligned in the first direction.

In another aspect, a device includes: a substrate having a first sideand a second side; an electronic circuit on the first side of thesubstrate; a first frame and a second frame; a first side encapsulantregion and a second side encapsulant region positioned between the firstand second frames; a first battery having a first pole layer, a firstelectrolyte layer and a second pole layer positioned between the firstand second frames, and between the first and second side encapsulantregions, wherein the first and second frames electrically andmechanically contact the electronic circuit on the first side of thesubstrate.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of embodiments of the inventionas claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of embodiments of the invention and are incorporated inand constitute a part of this specification, illustrate embodiments ofthe invention and together with the description serve to explain theprinciples of embodiments of the invention.

FIG. 1 is a top isometric view of a solid state power source with framesaccording to an embodiment of the invention.

FIG. 2 is a bottom isometric view of a solid state power source withframes according to an embodiment of the invention.

FIG. 3 is a top isometric view of a device including a solid state powersource with frames attached to an electronic circuit according to anembodiment of the invention.

FIG. 4 is a top isometric view of a device having a solid state powersource with frames attached to an electronic circuit according to anembodiment of the invention in which both the solid state power sourceand the electronic circuit are sealed in a hermetic enclosure of thedevice.

FIG. 5 a is a cross-sectional view along lines I-I′ shown in FIG. 3 ofan embodiment of the invention having portions of the electrolyte layerbetween the frames function as an encapsulant.

FIG. 5 b is a cross-sectional view along lines I-I′ shown in FIG. 3 ofan embodiment of the invention having peripheral region between theframes functions as an encapsulant.

FIG. 6 a is a detailed cross-sectional view of an embodiment at sectionA in FIG. 5 a.

FIG. 6 b is a detailed cross-sectional view of an embodiment at sectionAA in FIG. 5 b.

FIG. 7 a a cross-sectional view along lines B-B′ of the embodiment inFIG. 5 a.

FIG. 7 b a cross-sectional view along lines BB-BB′ of the embodiment inFIG. 5 b.

FIG. 8 a is a detailed cross-sectional view of section C of theembodiment in FIG. 5 a.

FIG. 8 b is a detailed cross-sectional view of section CC of theembodiment in FIG. 5 b.

FIG. 9 a is a plan view of a solid state power source with framesaccording to an embodiment of the invention shown in FIG. 5 a.

FIG. 9 b is a plan view of a solid state power source with framesaccording to an embodiment of the invention shown in FIG. 5 b.

FIG. 10 a is a plan view of first and second solid state power sourcesin parallel on same frames attached to an electronic circuit accordingto an embodiment of the invention.

FIG. 10 b is a side view of FIG. 10 a.

FIG. 11 is a side view of a first solid state power source with firstframes attached to an electronic circuit and a second solid state powersource with second frames attached to the same electronic circuitaccording to an embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention are not limited to the particularmethodology, compounds, materials, manufacturing techniques, uses, andapplications described herein, as these may vary. It is also to beunderstood that the terminology used herein is used for the purpose ofdescribing particular embodiments only, and is not intended to limit thescope of embodiments of the present invention. It must be noted that asused herein and in the appended claims, the singular forms “a,” “an,”and “the” include the plural reference unless the context clearlydictates otherwise. Thus, for example, a reference to “an element” is areference to one or more elements, and includes equivalents thereofknown to those skilled in the art. Similarly, for another example, areference to “a step” or “a means” is a reference to one or more stepsor means and may include sub-steps or subservient means. Allconjunctions used are to be understood in the most inclusive sensepossible. Thus, the word “or” should be understood as having thedefinition of a logical “or” rather than that of a logical “exclusiveor” unless the context clearly necessitates otherwise. Structuresdescribed herein are to be understood also to refer to functionalequivalents of such structures. Language that may be construed toexpress approximation should be so understood unless the context clearlydictates otherwise.

Reference will now be made in detail to the preferred embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. The invention may, however, be embodied in many differentforms and should not be construed as being limited to the embodimentsset forth herein; rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey theconcept of the invention to those skilled in the art. In the drawings,the thicknesses of layers and regions are exaggerated for clarity. Likereference numerals in the drawings denote like elements.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meanings as commonly understood by one of ordinary skillin the art to which this invention belongs. Preferred methods,techniques, devices and materials are described although any methods,techniques, devices, or materials similar or equivalent to thosedescribed may be used in the practice or testing of the presentinvention.

All patents and other publications discussed are incorporated herein byreference for the purpose of describing and disclosing, for example, themethodologies described in such publications that might be useful inconnection with the present invention. These publications are providedsolely for their disclosure prior to the filing date of the presentapplication. Nothing in this regard should be construed as an admissionthat the inventors are not entitled to antedate such disclosure byvirtue of prior invention or for any other reason.

FIGS. 1 and 2 are top and bottom isometric views of a solid state powersource with frames according to an embodiment of the invention. As shownin FIGS. 1 and 2, a power source 100 for a solid state device caninclude, for example, a component 101 with an electrochemical cell withone side contacting a top frame portion 102 a and another sidecontacting a bottom frame portion 103 a that is completely separatedfrom the top frame portion 102 a. The bottom frame portion 103 a can be,for example, connected to a bottom frame bonding portion 103 c through abottom frame extension portion 103 b positioned between the bottom frameportion 103 a and the bottom frame bonding portion 103 c. The top frameportion 102 a is, for example, connected to a top frame bonding portion102 c through a top frame extension portion 102 b positioned between thetop frame portion 102 a and the top frame bonding portion 102 c. The topframe extension portion 102 b extends past the component 101 of theelectrochemical cell. As shown in FIG. 2, the top frame bonding portion102 c and the bottom frame bonding portion 103 c can both, for example,be on one side of component 101. The power source 100 in embodiments ofthe invention is preferably an electrochemical cell using rechargeablelithium based chemistry.

FIG. 3 is a top isometric view of a solid state power source with framesattached to an electronic circuit according to an embodiment of theinvention. As shown in FIG. 3, an operational circuit 200 ismanufactured, for example, when the power source 100 is electricallyconnected to an electronic circuit 300. The top frame bonding portion102 c is bonded to the electronic circuit 300 and the bottom framebonding portion 103 c is bonded to the electronic circuit 300. Theopenings 110 in the top frame extension portion 102 b and the bottomframe extension portion 103 b can reduce thermal transfer between powersource 100 and the electronic circuit 300. Active electrical componentscan be integrated into the electronic circuit 300. Some exemplaryelectrical components that may be included in the electronic circuit 300are illustrated in the circuit of the device(s) described in U.S. Pat.No. 5,987,352, “Minimally Invasive Implantable Device for MonitoringPhysiologic Events” to Klein et al., incorporated herein by reference inits entirety. Further, the electrical components may include one or moreof a capacitor, resistor, inductor, transmitter, antenna, or an actuator(such as a micro-electromechanical device).

FIG. 4 is a top isometric view of a solid state power source with framesattached to an electronic circuit according to an embodiment of theinvention in which both the solid state power source and the electroniccircuit are sealed in a hermetic enclosure. As shown in FIG. 4, animplantable device 400 is, for example, an operational circuit 200 thatis, for example, within a hermetic enclosure 201. More specifically, forexample, a power source 100 including an electrochemical cell and frames102 and 103 can, for example, be coupled to electronic circuit 300 anddisposed within a hermetic enclosure 201. The operational circuit 200can be inserted into a sheath and then a dry inert gas can be injectedprior to the sheath being sealed to form a hermetic enclosure 201. Sucha sheath can be, for example, a polymer that can be heat sealed or ametal that is laser welded. Any type of sealing method can be used thatresults in a hermetic enclosure 201 being both an air tight and bodyfluid tight.

An electrochemical cell having rechargeable lithium based chemistry issusceptible to degradation in ambient air and more so in moisture ladenambient air. In addition, an electrochemical cell having rechargeablelithium based chemistry can emit vapors that chemically or reactivelyattack an electronic circuitry. Although the electrochemical cell of thecomponent 101 can, for example, use rechargeable lithium basedchemistry, the electronic circuit 300 is not attacked by vaporsemanating from electrochemical cell of the component 101 because theelectrochemical cell is, for example, integrally encapsulated. Further,the electrochemical cell of the component 101, for example, is notsusceptible to degradation due to ambient air or moisture laden ambientair because of the integral encapsulation of the electrolyte to theframes.

The integral encapsulation structure of the electrochemical cell in thecomponent 101 that bonds to the frame enables mounting or attachment ofthe power source 100 to the electronic circuit 300 in an ambientenvironment. Subsequent to such bonding, testing of the operationalcircuit 200 can then be performed in ambient air. After an operationalcircuit 200 is inserted into a sheath in ambient air, the interior ofthe sheath can be purged with an inert gas and then sealed to form thehermetic enclosure 201 so as to result in an exemplary hermeticallysealed implantable device 400.

FIG. 5 a is a cross-sectional view along lines I-I′ shown in FIG. 3 ofan embodiment of the invention having portions of the electrolyte layerbetween the frames that can function as an encapsulant. As shown in FIG.5 a, an electrolyte layer 106 can be positioned between an anode 105 andcathode 107. The electrolyte layer 106 together with the top framecontacting portion 102 a can, for example, completely surround the anode105. The electrolyte layer 106 together with the bottom frame contactingportion 103 a completely surround the cathode 107. The electrolyte 106can be, for example, a polymer containing an electrolytic salt. Althoughlayer 105 has been disclosed to be an anode and layer 107 has beendescribed as a cathode for purposes of describing an embodiment of theinvention, alternatively, layer 105 can be a cathode while layer 107 isan anode with the understanding that there is an appropriate polarityconnection to the electronic circuit 300. In general, layers 105 and 107can serve as posts of the electrochemical cell. The electrolyte layermay, for example, include materials as set forth in U.S. patentapplication Ser. No. 13/661,619 entitled “Fabrication of a High EnergyDensity Battery,” which is hereby incorporated by reference in itsentirety.

As also shown in FIG. 5 a, the top frame contacting portion 102 a andthe bottom frame contacting portion 103 a can be in the same directionD1. The top frame bonding portion 102 c and the bottom frame bondingportion 103 c can be, for example, in the same direction D1 as the topframe contacting portion 102 a and bottom frame contacting portion 103a. Further, the top frame bonding portion 102 c and the bottom framebonding portion 103 c can be, for example, in the same plane P1. The topframe extension portion 102 b and the bottom frame extension portion 103b can be, for example, in a same direction D2 that is substantiallyperpendicular to the direction D1 of both the top frame bonding portion102 c and the bottom frame bonding portion 103 c. The direction D2 ofthe top frame extension portion 102 b and the bottom frame extensionportion 103 b is, for example, substantially perpendicular to thedirection D1 of both the top frame bonding portion 102 c and the bottomframe bonding portion 103 c.

FIG. 5 b is a cross-sectional view along lines I-I′ shown in FIG. 3 ofan embodiment of the invention having peripheral region between theframes that can function as an encapsulant. As shown in FIG. 5 b, anelectrolyte layer 116 is positioned between an anode 105 and cathode107. The electrolyte 116 can be, for example, a polymer containing anelectrolytic salt. An encapsulant region 109 can peripherally surroundsthe electrolyte layer 116. The encapsulant region 109 together with theelectrolyte layer 116 and the top frame contacting portion 102 a can,for example, completely surround the anode 105. The encapsulant region109 together with the electrolyte layer 116 and the bottom framecontacting portion 103 a can completely surround the cathode 107. Theencapsulant region 109 is, for example, a polymer that does not containan electrolyte salt. The exemplary polymer of the encapsulant region 109can have the same composition as the polymer in the electrolyte layer106 or a different composition.

In the simplest form, the electrolyte layer may include one or more ofthe following, preferred polymers and derivatives thereof:Poly(vinylidene fluoride), poly(tetrafluoroethylene), polyacrylate,polyacrylonitrile, polyethylene, polypropylene, polyester, polyamide,polyimide, polyether, polycarbonate, polysulfone, and silicone. Toprovide these polymers with electrolytic properties, the polymers may becomposited with at least one lithium salt, preferably selected from thegroup of lithium hexafluorophosphate, lithium hexafluoroantimonate,lithium tetrafluoroborate, lithium bis(trifluoromethylsulfonyl)imide,and lithium bis(fluorosulfonyl)imide. For example, electrolyte layer 106may be composed of polyacrylonitrile, polysulfone, and lithiumtetrafluoroborate while encapsulant region 109 may be composed only ofpolyacrylonitrile and polysulfone. In another example, electrolyte later106 may be composed of polyacrylonitrile, polysulfone, and lithiumtetrafluoroborate while encapsulant region 109 may consist ofpoly(tetrafluoroethylene).

As also shown in FIG. 5 b, the top frame contacting portion 102 a andthe bottom frame contacting portion 103 a are in the same direction D1.The top frame bonding portion 102 c and the bottom frame bonding portion103 c are in the same direction D1 as the top frame contacting portion102 a and bottom frame contacting portion 103 a. Further, the top framebonding portion 102 c and the bottom frame bonding portion 103 c are,for example, in the same plane P1. The top frame extension portion 102 band the bottom frame extension portion 103 b are in a same direction D2that is substantially perpendicular to the direction D1 of both the topframe contacting portion 102 a and the bottom frame contacting portion103 a. The direction D2 of the top frame extension portion 102 b and thebottom frame extension portion 103 b is, for example, substantiallyperpendicular to the direction D1 of both the top frame bonding portion102 c and the bottom frame bonding portion 103 c.

FIG. 6 a is a detailed cross-sectional view of an embodiment at sectionA in FIG. 5 a. As shown in FIG. 6 a, an upper electrolyte layer portion106 a can be between an anode side 105 b and the top frame extensionportion 102 b while a lower electrolyte layer portion 106 b can bebetween a cathode side 107 b and the top frame extension portion 102 b.A middle electrolyte layer portion 106 c can be positioned between alower anode side 105 c and an upper cathode side 107 a. An upperconductive adhesive layer 104 can, for example, be positioned betweenthe top frame contacting portion 102 a and an upper anode side 105 a. Alower conductive adhesive layer 108 can, for example, be positionedbetween the bottom frame contacting portion 103 a and a lower cathodeside 107 c. In an alternative, the upper conductive adhesive layer 104and the lower conductive adhesive layer 108 can be omitted such that thetop frame contacting portion 102 a is adhered to the upper anode side105 a and the bottom frame contacting portion 103 a is adhered to thelower cathode side 107 c. An electrical insulation film 112 can bepositioned between the top frame extension portion 102 b and cathodeside 107 b to prevent an undesired electrical affect between top frameextension portion 102 b and cathode side 107 b through the lowerelectrolyte layer portion 106 b. The electrical insulation film 112 canbe on at least one of the top frame extension portion 102 b or the lowerelectrolyte layer portion 106 b. For example, the insulating film 112can be MgO.

FIG. 6 b is a detailed cross-sectional view of an embodiment at sectionAA in FIG. 5 b. As shown in FIG. 6 b, an encapsulant region 109 a can bebetween an anode side 105 b and the top frame extension portion 102 band also can, for example, extend between a cathode side 107 b and thetop frame extension portion 102 b. The electrolyte layer 116 can bepositioned between a lower anode side 105 c and an upper cathode side107 a. An upper conductive adhesive layer 104 can, for example, bepositioned between the top frame contacting portion 102 a and an upperanode side 105 a. A lower conductive adhesive layer 108 can, forexample, be positioned between the bottom frame contacting portion 103 aand a lower cathode side 107 c. In an alternative, the upper conductiveadhesive layer 104 and the lower conductive adhesive layer 108 can beomitted such that the top frame contacting portion 102 a is adhered tothe upper anode side 105 a and the bottom frame contacting portion 103 ais adhered to the lower cathode side 107 c.

FIG. 7 a is a cross-sectional view along lines B-B′ of the embodiment inFIG. 5 a. As shown in FIG. 7 a, side electrolyte layer portions 106 dand 106 e are, for example, positioned between the top frame contactingportion 102 a and the bottom frame contacting portion 103 a. The sideelectrolyte layer portions 106 d and 106 e can, for example, extendbeyond the top frame contacting portion 102 a and the bottom framecontacting portion 103 a. The middle electrolyte layer portion 106 c canbe positioned between the anode 105 and the cathode 107. The top framebonding portion 102 c can be electrically and mechanically connected tothe electronic circuit 300 with a conductive connection adhesive 113 a.

FIG. 7 b is a cross-sectional view along lines BB-BB′ of the embodimentin FIG. 5 b. As shown in FIG. 7 b, side encapsulant regions 109 b and109 c can, for example, be positioned between the top frame contactingportion 102 a and the bottom frame contacting portion 103 a. The sideencapsulant regions 109 a and 109 b can, for example, extend beyond thetop frame contacting portion 102 a and the bottom frame contactingportion 103 a. The electrolyte layer 116 can be positioned between theanode 105 and the cathode 107. The top frame bonding portion 102 c canbe electrically and mechanically connected to the electronic circuit 300with a conductive connection adhesive 113 a.

FIG. 8 a is a detailed cross-sectional view of section C of theembodiment in FIG. 5 a. As shown in FIG. 8 a, an upper electrolyte layerportion 106 d is, for example, at an anode side 105 d and a lowerelectrolyte layer portion 106 e is, for example, at a cathode side 107d. The middle electrolyte layer portion 106 c can be positioned betweena lower anode side 105 c and an upper cathode side 107 a. The upperelectrolyte layer portion 106 d and the lower electrolyte layer portion106 e can, for example, extend beyond the top frame contacting portion102 a. The bottom frame bonding portion 103 c can, for example, beelectrically and mechanically connected to the electronic circuit 300with a conductive connection adhesive 113 b.

FIG. 8 b is a detailed cross-sectional view of section CC of theembodiment in FIG. 5 b. As shown in FIG. 8 b, a side encapsulant region109 d is, for example, at an anode side 105 d and at a cathode side 107d. The electrolyte layer 116 can be positioned between a lower anodeside 105 c and an upper cathode side 107 a. The side encapsulant region109 d can, for example, extend beyond the top frame contacting portion102 a. The bottom frame bonding portion 103 c is, for example,electrically and mechanically connected to the electronic circuit 300with a conductive connection adhesive 113 b.

FIG. 9 a is a plan view of a solid state power source with framesaccording to an embodiment of the invention shown in FIG. 5 a. As shownin FIG. 9 a, the electrolyte layer can extend beyond three sides of thetop frame contacting portion 102 a. The anode 105 and cathode 107 are,for example, within the sides of the top frame contacting portion 102 a.

FIG. 9 b is a plan view of a solid state power source with framesaccording to an embodiment of the invention shown in FIG. 5 b. As shownin FIG. 9 b, the integral encapsulant region 109 extends beyond threesides of the top frame contacting portion 102 a. The anode 105,electrolyte layer and cathode 107 are, for example, within the sides ofthe top frame contacting portion 102 a.

FIG. 10 a is a plan view of first and second solid state power sourcesin parallel on same frames attached to an electronic circuit accordingto an embodiment of the invention. FIG. 10 b is a side view of FIG. 10a. As shown in FIGS. 10 a and 10 b, a double cell power source 500 for asolid state device includes, for example, a first bare structure of anelectrochemical cell X and a second bare structure of an electrochemicalcell Y that are both, for example, positioned between a top framecontacting portion 121 a and a bottom frame contacting portion 121 c.The top frame contacting portion 121 a is, for example, connected to atop frame bonding portion 121 c through a top frame extension portion121 b. The bottom frame contacting portion 121 c is, for example,connected to a bottom frame bonding portion 123 c through a top frameextension portion 123 b.

FIG. 11 is a side view of a first solid state power source with firstframes attached to an electronic circuit and a second solid state powersource with second frames attached to the same electronic circuitaccording to an embodiment of the invention. As shown in FIG. 11, a dualpower source architecture 600 for a solid state device includes, forexample, a first power source 100 a on one surface of the electroniccircuit 301 and a second power source 100 b on an opposite surface ofthe electronic circuit 301. Although the first and second power sources100 a and 100 b are on opposite sides of the electronic circuit, thefirst and second power sources 100 a and 100 b can be electricallyconnected in parallel.

The embodiments and examples described above are exemplary only. Oneskilled in the art may recognize variations from the embodimentsspecifically described here, which are intended to be within the scopeof this disclosure and invention. As such, the invention is limited onlyby the following claims. Thus, it is intended that the present inventioncover the modifications of this invention provided that they come withinthe scope of the appended claims and their equivalents.

1. A power source for a solid state device, comprising: a first framehaving a first contact portion, a first bonding portion and a firstextension portion between the first contact portion and the firstbonding portion; a second frame having a second contact portion, asecond bonding portion and a second extension portion between the secondcontact portion and the second bonding portion; and a first pole layer,an electrolyte layer and a second pole layer positioned between thefirst and second contact portions, wherein a first portion of theelectrolyte layer is positioned between the first extension and thefirst pole and a second portion of the electrolyte layer is positionedbetween the first extension and the second pole.
 2. The power source fora solid state device according to claim 1, wherein a third portion ofthe electrolyte layer is positioned between the first pole and thesecond pole.
 3. The power source for a solid state device according toclaim 1, wherein the first contact portion is attached to the first polelayer with a first conductive adhesive layer and the second contactportion is attached to the second pole layer with a second conductiveadhesive layer.
 4. The power source for a solid state device accordingto claim 1, further comprising a third pole layer, a second electrolytelayer and a fourth pole layer positioned between the first and secondcontact portions.
 5. The power source for a solid state device accordingto claim 1, wherein the electrolyte layer, including the first andsecond portions, encapsulates the first and second poles.
 6. The powersource for a solid state device according to claim 1, furthercomprising: an electronic circuit, wherein the first bonding portion iselectrically and mechanically bonded to the electronic circuit with afirst conductive connection adhesive and the second bonding portion iselectrically and mechanically bonded to the electronic circuit with asecond conductive connection adhesive.
 7. The power source for a solidstate device according to claim 6, further comprising a third framehaving a third contact portion, a third bonding portion and a thirdextension portion between the third contact portion and the thirdbonding portion; a fourth frame having a fourth contact portion, afourth bonding portion and a fourth extension portion between the fourthcontact portion and the fourth bonding portion; and a third pole layer,a second electrolyte layer and a fourth pole layer positioned betweenthe third and fourth contact portions, wherein the third bonding portionis electrically and mechanically bonded to the electronic circuit with afirst conductive connection adhesive and the fourth bonding portion iselectrically and mechanically bonded to the electronic circuit with asecond conductive connection adhesive.
 8. The power source for a solidstate device according to claim 6, wherein the first frame, secondframe, first pole layer, electrolyte layer, second pole layer andelectronic circuit are hermetically sealed in an enclosure.
 9. A powersource for a solid state device, comprising: a first frame having afirst contact portion, a first bonding portion and a first extensionportion between the first contact portion and the first bonding portion;a second frame having a second contact portion, a second bonding portionand a second extension portion between the second contact portion andthe second bonding portion; first and second side encapsulant regionspositioned between the first and second contact portions, and a firstpole layer, a first electrolyte layer and a second pole layer positionedbetween the first and second contact portions, and between the first andsecond side encapsulant regions.
 10. The power source for a solid statedevice according to claim 9, wherein the first electrolyte layer is acomposite including an electrolyte salt and a first polymer, and thefirst and second side encapsulant regions include the first polymer. 11.The power source for a solid state device according to claim 10, furthercomprising third and fourth side encapsulant regions positioned betweenthe first and second contact portions such that the first, second, thirdand fourth encapsulant regions encircle the first and second poles. 12.The power source for a solid state device according to claim 9, whereinthe first electrolyte layer is a composite including an electrolyte saltand a first polymer and the first and second side encapsulant regionsinclude a second polymer different than the first polymer.
 13. The powersource for a solid state device according to claim 12, furthercomprising third and fourth side encapsulant regions positioned betweenthe first and second contact portions such that the first, second, thirdand fourth encapsulant regions encircle the first and second poles. 14.The power source for a solid state device according to claim 9, whereinthe first contact portion is attached to the first pole layer with afirst conductive adhesive layer and the second contact portion isattached to the second pole layer with a second conductive adhesivelayer.
 15. The power source for a solid state device according to claim9, further comprising; a third pole layer, a second electrolyte layerand a fourth pole layer positioned between the first and second contactportions.
 16. The power source for a solid state device according toclaim 9, further comprising: an electronic circuit, wherein the firstbonding portion is electrically and mechanically bonded to theelectronic circuit with a first conductive connection adhesive and thesecond bonding portion is electrically and mechanically connected to theelectronic circuit with a second conductive connection adhesive.
 17. Thepower source for a solid state device according to claim 16, furthercomprising: a third frame having a third contact portion, a thirdbonding portion and a third extension portion between the third contactportion and the third bonding portion; a fourth frame having a fourthcontact portion, a fourth bonding portion and a fourth extension portionbetween the fourth contact portion and the fourth bonding portion; and athird pole layer, a second electrolyte layer and a fourth pole layerpositioned between the third and fourth contact portions, wherein thethird bonding portion is electrically and mechanically bonded to theelectronic circuit with a third conductive connection adhesive and thefourth bonding portion is electrically and mechanically bonded to theelectronic circuit with a forth conductive connection adhesive.
 18. Thepower source for a solid state device according to claim 16, wherein thefirst frame, second frame, first side encapsulant region, secondencapsulant region, first pole layer, electrolyte layer, second polelayer and electronic circuit are hermetically sealed in an enclosure.19. A power source for a solid state device, comprising: a first framehaving a first contact portion, a first bonding portion and a firstextension portion between the first contact portion and the firstbonding portion; a second frame having a second contact portion, asecond bonding portion and a second extension portion between the secondcontact portion and the second bonding portion; a first pole layer, anelectrolyte layer and a second pole layer positioned between the firstand second contact portions; and an encapsulant between the first andsecond contact portions, wherein the first and second bonding portionsare aligned in a first direction and the first and second contactportions are aligned in the first direction.
 20. The power source for asolid state device according to claim 19, wherein the first and secondextension portions are both aligned in a second direction.
 21. The powersource for a solid state device according to claim 19, wherein the firstand second bonding portions are in a same plane.
 22. The power sourcefor a solid state device according to claim 19, wherein the electrolytelayer surrounds the first and second poles.
 23. The power source for asolid state device according to claim 19, further comprising first,second, third and fourth side encapsulant regions positioned between thefirst and second contact portions such that the first, second, third andfourth encapsulant regions surround the first and second poles.
 24. Thepower source for a solid state device according to claim 23, wherein theelectrolyte layer is a composite including an electrolyte salt and afirst polymer and the first, second, third and fourth encapsulantregions include said first polymer.
 25. The power source for a solidstate device according to claim 23, wherein the electrolyte layer is acomposite including an electrolyte salt and a first polymer and thefirst, second, third and fourth encapsulant regions include a secondpolymer different than the first polymer.
 26. The power source for asolid state device according to claim 19, wherein the first contactportion is attached to the first pole layer with a first conductiveadhesive and the second contact portion is attached to the second polelayer with a second conductive adhesive.
 27. The power source for asolid state device according to claim 19, further comprising: a thirdpole layer, a second electrolyte layer and a fourth pole layerpositioned between the first and second contact portions.
 28. The powersource for a solid state device according to claim 19, furthercomprising: an electronic circuit, wherein the first bonding portion iselectrically and mechanically bonded to the electronic circuit with afirst conductive connection adhesive and the second bonding portion iselectrically and mechanically bonded to the electronic circuit with afirst conductive connection adhesive.
 29. The power source for a solidstate device according to claim 28, further comprising: a third framehaving a third contact portion, a third bonding portion and a thirdextension portion between the third contact portion and the thirdbonding portion; a fourth frame having a fourth contact portion, afourth bonding portion and a fourth extension portion between the fourthcontact portion and the fourth bonding portion; and a third pole layer,a second electrolyte layer and a fourth pole layer positioned betweenthe third and fourth contact portions, wherein the third bonding portionis electrically and mechanically bonded to the electronic circuit andthe fourth bonding portion is electrically and mechanically bonded tothe electronic circuit.
 30. The power source for a solid state deviceaccording to claim 28, wherein the first frame, second frame, first polelayer, electrolyte layer, second pole layer and electronic circuit arehermetically sealed in an enclosure. 31-40. (canceled)